F3 Nano Coating

Asahitec's F3 Nano Coating was developed to overcome the challenges of smaller apertures sizes and optimizing the process throughput. We noticed that our customers had two basic problems. Aperture sizes were getting smaller. And at the same time consumable costs were getting higher. F3 Nano Coating is basically a fluxophobic coating which is applied on the stencil after F2 Polishing. This reduces the surface tension of the surface of the material thus reducing the ability of paste to stick onto the aperture walls and the bottom side of the stencil hence reducing smearing and bridging. Furthermore it also enhances the cleaning efficiency of the stencil wiper as thus wipes can be set less frequently.

• Improves paste release thus increasing yield
• Improves gasketing of stencil to PCB ths reducing smearing and bridging
• Reduces cleaning frequency and efficiency
• Reduces cost of cleaning consumables